| Processors | ARM Cortex-A15/-A9/-A8, ARM 9, ARM 11, Renesas SH4A, Cortex-Mx |
| Memory | DDR3/2/1, NOR Flash, NAND Flash, MLC, SLC and eMMC |
| Tethered communication | SPI, I²C, UART, Ethernet, USB-H/-D/-OTG, PCIe, S-ATA… |
| Field bus | CAN, Profibus, Profinet, Powerlink, EtherCAT…) |
| Wireless communication | WiFi, Bluetooth, ZigBee, Z-Wave… |
| Board technologies | Multi-layer, HDI, micro-via, bling-vias, buried vias, BGA 0,5mm pitch… |
| Difficult environments | temperatures from -40°C to +85°C, humidity, CEM, rugged design |
| Systems for | battery operated/portable equipment, vehicle technology, automation technology… |
| Multimedia | cameras, LVDS, HDMI, multiple monitors, capacitive touch screens |